3D Printing for Semiconductors: Market Opportunity Brief
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Table of Contents
“3D Printing for Semiconductors” is both an incisive and thorough analysis of the state and outlook for additive manufacturing (AM) technologies to optimize and entrench into the semiconductor industry.
The report features a comprehensive written market analysis and a companion Excel file of historical market data as well as a 10-year forecast.
The report identifies specific cases for AM within the semiconductor value chain, including reduced lead times, reduced parts, and thermal management, packaging, and more. The report considers the implications for AM of such broader initiatives as the CHIPs Act and other geopolitical actions and trends.
The companion Excel file details semiconductor markets various AM technologies including Powder Bed Fusion (PBF), Directed Energy Deposition (DED), Metal Binder Jetting (MBJ), and Bound Metal Deposition (BMD). Breakout are also provided by metal, polymer, ceramic and speciality metal powders, as well as by geography.
Companies and organizations mentioned or profiled include but are not limited to: ASML, 3D Systems, Lam Research, Velo3D, Applied Materials, SIMTech, Fabric8Labs, Intel, Coherent, and Nikon Advanced Manufacturing.
