AM for Data Centers: a 3D Printing Market Opportunity

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Published on Feb 27, 2025 SKU AMR-AMDC3DP-0225 Category Uncategorized Tags Data Reports, Market Studies

Table of Contents

Chapter One: The Data Center Boom: Searching for AM’s Next Big Win

1.1 The Data Center Opportunity in Light of an Existing AM Success Story

1.2 Cooling Data Centers: The Right Application for the Right Customer

1.3 Contextualizing the Data Center Market in its AI Boom Phase

Chapter Two: The Cooling Needs of Data Centers, and Why/How AM Should

Deliver Them

2.1 The Evolution of Data Center Cooling Technology

2.2 Looking for a Problem: AM and Thermal Management

2.3 AM and the Data Center Value Chain: Reading Between the Lines

2.4 Partnering with the Data Center Industry

Chapter Three: Quantifying AM Opportunities in Data Centers

Chapter Four: Conclusion — Strike While the Servers are Hot

About Additive Manufacturing Research

About the Analyst

List of Exhibits

Exhibit 3-1: Penetration Rate Analysis for AM in Data Center Applications

Exhibit 3-2: Market Value of AM Parts Produced for Data Centers in the U.S. ($US Million), by Application Group

Exhibit 3-3: AM Production System Demand Resulting from Data Center Adoption

by AM Technology Type

This report, built on proprietary AM Research market data, analyzes the ongoing global boom in data center construction from the perspective of the potential it represents for Additive Manufacturing (AM) industry penetration.

From the report:

Some 2,000 PBF machines could be needed to produce cold plates and other data center parts by 2033 even at a relatively conservative penetration rate, and even assuming PBF will share some of the production with other relevant AM processes.

For reference, this is already more machines than are sold each year in the total AM market today.

This report focuses on the market for data center infrastructure, with a particular concentration on thermal management solutions for hyperscale data centers. Hyperscale data centers, defined as those with 5,000 or more servers, are the largest consumers of the most advanced chips driving the growth in AI applications.

With the number of hyperscale data centers projected to double every few years over the next decade, a proportionate demand will ensue for equipment related to heating and cooling solutions. AM has the unique potential to alleviate supply chain uncertainty, due to regulation and geopolitics, for the next-generation thermal management hardware required to bring new data center capacity online.

Market data, penetration rates, and forecasting are built using proprietary modeling and existing AM Research market data and deepened and contextualized by exhaustive research and direct interviews with several industry players. The written report comes along with a companion Excel market data file.

Companies and organizations mentioned or profiled include but are not limited to: Alfa Laval, Asetek, Conflux Technology, DeepSeek, Fabric8Labs, Schneider Electric, Vertiv, OpenAI, Amazon, and GE Vernova.

AM Research’s reports are intended as key strategic inputs for all senior executives planning 3D printing product/market strategies and for investors who are looking to take equity positions in 3D printing firms.

AM Research also offers customized consulting and due diligence analysis.